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E-llum Thermalvector

E-Wenco

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E-llum Thermalvector is a special fluid that is able to transfer and remove large power density thanks to its high energy transport volume density.

E-llum Thermalvector is therefore a valid alternative for the heating of surfaces or pipelines with solid masses or diathermic liquids, such as press plates, moulds, irregularly shaped pipelines, heating of three-dimensional masses, etc.

Thanks to its outstanding characteristics, it is therefore possible to create heating surfaces with excellent heating uniformity and drastically reduced heating up and peak energy absorption times compared to the conventional electric resistors..

TECHNICAL CHARACTERISTICS

 

    • POWER DESPITE up to 200 W/cm2

    • HIGH FLUIDITY with limited pressure drops along pipelines

    • HIGH WETTING CAPACITY with a choice of surface contact material to promote adhesion or fluid cohesion

    • HIGH CAPACITY OF HEAT EXCHANGE with rapid heat transfer

EXCLUSIVE ADVANTAGE: E-llum Thermalvector is able to supply and remove heat from a surface. This means being able to have perfect and uniform temperature modulation in one system..

E-LLUM THERMALVECTOR SYSTEM

The E-llum Thermalvector system consists of a heating surface + heating and holding engine; in addition, a cooling system can be added.

The E-llum Thermalvector System is ideal for:

 

    • Retrofitting

    • Reduction of peak energy consumption (50%)

    • Increased production capacity (>15%)

    • Reduction of heating up time (50%)

    • Thermal uniformity

    • Heat and cold in a single device

EXAMPLE OF APPLICATION: HEATING A SURFACE

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    Picture 1

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    Picture  2

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    Picture  3

PIC 1. Current situation.
Heating resistors are located in the centre of the mass to
allow uniform heating. Cooling takes place with a
water channel system close to the path of the resistors.

PIC 2. Upgrade E-llum Thermalvector.
Thanks to the extraordinary thermal capabilities and a detailed fluid-dynamic
study, the the E-llum Thermalvector channels’s  can be concentrate on the surface of the mould, allowing
greater surface heat uniformity and a reduction 
up to 50% of process heating up.

PIC 3. E-llum Thermalvector Upgrade.
The heating system itself becomes a rapid cooling system.
Less consumption, more efficiency.

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    E-llum Thermalvector distribution system

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    E-llum Thermalvector tile